Izixhobo zeMveliso yeRFID
-
Ileyibhile ye-RFID Reel ye-UV yokuPrinta, ukuFunda kunye nokuFaka ikhowudi, iModeli yoMshini oThola: YMJ-LP30
Iinkcazo ngokubanzi
Umatshini wokuPrinta i-RFID Reel Label UV, i-Encoding kunye ne-Detecting yi-inkjet yeleyibhile ye-elektroniki + izixhobo zokufunda nokubhala idatha; Yenzelwe ngokukodwa ukuprinta, ukufunda, ukufaka ikhowudi kunye nokufumanisa iimveliso zeleyibhile ye-elektroniki ezijikelezayo ukusuka kumqolo omnye ukuya kumqolo omnye. Ngokweemfuno zemveliso, esi sixhobo sikwabandakanya le misebenzi ilandelayo:
- Umsebenzi wokuseta iphimbo lethegi;
- Ileyibhile engalunganga eqhubekayo, umsebenzi we-alamu yokuseta ileyibhile engenanto;
- Umsebenzi wokufumanisa izinto ongekhoyo;
- Umsebenzi wokuseta isantya sokuvelisa ekujoliswe kuso;
-
Ukuprinta, Ukufunda nokubhala, umatshini wokufumanisa i-RFID Single Tag/Card UV
Iinkcazo ngokubanzi
Ukuprinta, Ukufunda nokubhala, umatshini wokufumanisa i-RFID Single Tag/Card UV
Imodeli: YMJ-SP120Ezi zixhobo zisetyenziswa ekukhutshweni kwekhadi lethegi enye, ukuprinta, ukufumanisa ukufunda nokubhala kunye nokuqokelelwa kwemveliso egqityiweyo.
Isakhiwo samagama asixhenxe sisetyenziselwa ukuqokelela izinto kunye nokunciphisa ubude bendawo.
-
Imodeli yoMshini woGuqulo lweRFID: CM75+2
Iinkcazo ngokubanzi
Lo matshini ngumatshini wokusika idayisi odibeneyo onemijelo emibini (oneeshafti ezimbini zokutya ezingaphakathi) oxhotyiswe ngeeyunithi zokusika idayisi ezimbini.
Inkqubo yokwenza izinto ezininzi ekwaziyo ukuvelisa ezi ntlobo zilandelayo zeemveliso zeRFID: iilebhile zeRFID ezibuthathaka ezichasene neemveliso zobuxoki, iilebhile zeRFID zonyango, iibhanti zesandla zeRFID, iilebhile zemithwalo yeenqwelo moya zeRFID, iilebhile zokuxhoma iimpahla zeRFID, kunye neelebhile zokuncamathelisa zeRFID.
-
Imodeli yoMatshini wokuHlanganisa iiChip zeRFID: ST-FC180
Iinkcazo ngokubanzi
I-RFIDImodeli yoMatshini wokuhlanganisa iiChip: ST-FC180
Umatshini wokubopha iitshiphusi ze-RFID ezizenzekelayo ezipheleleyo usetyenziselwa i-HF、UHF chip bonding, ububanzi bewebhu ye-substrate (ulwalathiso lweCD) ukuya kuthi ga kwi-200MM, umatshini udityaniswe ne-antenna unwind, i-glue dispense, i-die attach, i-hot press, i-QC verification, i-bad inlay dot, njl.njl. imisebenzi, i-8 kunye ne-12 intshi yediski ye-wafer iyahambelana, i-6 intshi yediski ye-wafer kufunekaeyenziwe ngokwezifisoyenziwe.
