Imodeli yoMatshini wokuHlanganisa iiChip zeRFID: ST-FC180

Iinkcazo ngokubanzi

I-RFIDImodeli yoMatshini wokuhlanganisa iiChip: ST-FC180
Umatshini wokubopha iitshiphusi ze-RFID ezizenzekelayo ezipheleleyo usetyenziselwa i-HF、UHF chip bonding, ububanzi bewebhu ye-substrate (ulwalathiso lweCD) ukuya kuthi ga kwi-200MM, umatshini udityaniswe ne-antenna unwind, i-glue dispense, i-die attach, i-hot press, i-QC verification, i-bad inlay dot, njl.njl. imisebenzi, i-8 kunye ne-12 intshi yediski ye-wafer iyahambelana, i-6 intshi yediski ye-wafer kufunekaeyenziwe ngokwezifisoyenziwe.

Qhagamshelana Nathi Ngoku ukuze ufumane iisampuli !!!

Thumela i-imeyile kuthi

info@focusrfid.com

+8618560195575

Iinkcukacha zeMveliso

Iithegi zeMveliso

Intshayelelo

1. Esi sixhobo sikhethekileyo senzelwe ukuveliswa kweRFID inlays kunye ne-chip bonding. Sifanelekile kwi-single-row flip-chip bonding yeemveliso ezinee-antenna ezingabonakaliyo okanye ezicacileyo (ezifana nee-antenna zePET ezisekelwe ephepheni okanye ezingabonakaliyo).
2. Isebenzisa inkqubo yokuqaphela umbono enobuchule, umatshini uchonga ngokuchanekileyo kwaye ufumane iitships ezincinci—ezifumaneka kwiitreyi—kunye nee-antenna eziguquguqukayo; emva koko, ii-actuators ezikhawulezayo nezichanekileyo zenza ukubopha ngokuchanekileyo kweetships kwii-antenna.

Iimbonakalo

Ifanelekile kwi-PET, i-antenna yephepha;
Izinto ze-substrate Ububanzi：30 ~ 200mm, ubukhulu:≥50μm, indawo yokudibanisa i-antenna isembindini;
Wubukhulu bediski emva: 8 kunye ne-12 intshi,
Wubungakanani obungaphantsi: 0.35*0.3mm ukuya kwi-3*3mm ngeli xesha;
Tubukhulu be-wafer: 0.075-0.16mm;
Iglu: I-ACP iyamkeleka, i-NCP: ayikaqinisekiswa okwangoku;
Pumda wokurhawuzelela kwi-axis ye-X kunye ne-Y:ubuncinci15mm, ubuninzi obuyi-240mm (phawula: iphimbo kufuneka libe yi-integer multiple phakathi kwe-157 kunye ne-240mm)

Iinkcukacha zoBugcisa

#	Ipharamitha	Ixabiso
1	Ubukhulu	L6000W1300H1750 (mm)
2	Ubunzima	Malunga ne-2000 KG
3	I-Voltage elinganisiweyo	Isigaba sesithathu, i-AC380V
4	Amandla Alinganisiweyo	Malunga ne-16 KW
5	Uxinzelelo Lomoya	0.6 ~ 0.8 MPa
6	Ukusetyenziswa koMoya	Malunga ne-100 L/MIN
7	Inombolo yoMsebenzi	Umntu o-1
8	Uhlobo loLawulo	PC
9	Inkqubo yokusebenza	Phumelela i-10
10	I-UPH	Iphimbo 25mm: 15000 ii-pcs/h
		Iphimbo 50mm: 7500 ~ 8000 ii-pcs/h
		Iphimbo 150mm: 2600 ii-pcs/h
11	Yima kancinci	99.70%
12	Ingxolo	≤85 DB
13	Ukuchaneka kweDie Attach	± 0.05 mm
14	Izixhobo zokusetyenziswa	I-inlay eyomileyo enye
15	I-substrate	I-PET, iphepha; ubukhulu: ≥0.05 mm
16	Utshintsho Ngexesha — Utshintsho olupheleleyo lweMveliso (i-antenna kunye netshiphu kwaye mhlawumbi i-ACP/NCP)	Malunga nemizuzu eli-150
17	Utshintsho ngokuhamba kwexesha — I-Wafer/Itshiphusi Kuphela	imizuzu emi-5